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Universiti
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IC FA Unit 6 Die Deprocessing
sharifuddin.mamat
36
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# 1

pilihan

What is the primary purpose of die deprocessing in failure analysis?

  • To increase the electrical conductivity of the die
  • To expose buried defects by removing upper layers
  • To improve the die's overall performance
  • To package the die more effectively

# 2

pilihan

Which of the following is NOT a common die deprocessing technique?

  • Wet chemical etching
  • Dry plasma etching
  • Mechanical polishing
  • Chemical vapor deposition

# 3

pilihan

What is the main difference between wet etching and dry etching?

  • Wet etching is faster than dry etching
  • Wet etching is isotropic, while dry etching can be anisotropic
  • Dry etching uses only water-based solutions
  • Dry etching is less selective than wet etching

# 4

pilihan

What is a disadvantage of wet etching?

  • It cannot etch any materials
  • It produces unwanted undercutting due to isotropic etching
  • It is too slow for practical use
  • It only works on metallic layers

# 5

pilihan

Why is wet chemical etching considered isotropic?

  • It etches only in the vertical direction
  • It etches equally in horizontal and vertical directions
  • It only etches specific materials
  • It is a highly selective process

# 6

pilihan

Which type of dry etching uses ion bombardment and chemical reactions?

  • Pure physical sputtering
  • Pure chemical etching
  • Reactive Ion Etching (RIE)
  • Mechanical polishing

# 7

pilihan

What is the main advantage of mechanical polishing in die deprocessing?

  • It is faster than chemical methods
  • It provides the ability to stop mid-layer and view features in the same plane
  • It does not require abrasive materials
  • It is highly automated and requires no skill

# 8

pilihan

Which passivation layers are commonly removed during die deprocessing?

  • Metal layers
  • Passivation layers such as oxide or nitride
  • Silicon substrate
  • Bonding wires

# 9

pilihan

In wet etching, what does the etch rate depend on?

  • The color of the etchant
  • Temperature, concentration, and time
  • The size of the wafer
  • The electrical conductivity of the material

# 10

pilihan

What is the main goal of anisotropic dry etching?

  • To etch uniformly in all directions
  • To achieve different etch rates in horizontal and vertical directions
  • To only etch metallic layers
  • To prevent any etching from occurring

# 11

pilihan

Which plasma etching process involves physical sputtering without chemical reactions?

  • Pure chemical etch
  • Reactive Ion Etching (RIE)
  • Pure physical sputtering
  • Wet chemical etching

# 12

pilihan

What is a key limitation of mechanical polishing?

  • It cannot remove metal layers
  • It is time-consuming and hard to maintain planarity
  • It is only suitable for small wafers
  • It damages the die permanently

# 13

pilihan

Which of the following is a chemical characterization technique used in failure analysis?

  • Scanning Electron Microscopy (SEM)
  • Energy Dispersive X-Ray Analysis (EDAX)
  • Optical Microscopy
  • X-ray Diffraction (XRD)

# 14

pilihan

What is the typical sequence in die deprocessing?

  • Mechanical polishing first, then chemical etching
  • Chemical etching first, then plasma etching
  • Plasma or reactive ion etching first, then wet chemical etching
  • Only mechanical polishing is used

# 15

pilihan

Why is selective deprocessing used?

  • To remove all layers uniformly
  • To remove passivation layers at specific regions
  • To prevent any layer removal
  • To increase the thickness of the layers

# 16

pilihan

What is the role of plasma in dry etching?

  • To cool the wafer
  • To generate reactive species and ions for etching
  • To deposit thin films
  • To clean the surface without etching

# 17

pilihan

Which dry etching method is highly anisotropic and uses ions for etching?

  • Pure chemical etching
  • Pure physical sputtering
  • Reactive Ion Etching (RIE)
  • Wet etching

# 18

pilihan

What is the main disadvantage of wet etching?

  • It cannot etch any materials
  • It causes unwanted undercutting and loss of feature integrity
  • It is too slow
  • It requires high vacuum

# 19

pilihan

Which technique allows for viewing features at different depths within the same plane?

  • Wet etching
  • Dry plasma etching
  • Mechanical polishing
  • Chemical vapor deposition

# 20

pilihan

What is the typical purpose of passivation layers in semiconductor devices?

  • To conduct electricity
  • To prevent physical damage and contamination
  • To serve as the main conducting layer
  • To attach the die to the package
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